SI/PI-Database of PCB-Based Interconnects for Machine Learning Applications

Author:

Schierholz MortenORCID,Sanchez-Masis AllanORCID,Carmona-Cruz AllanORCID,Duan Xiaomin,Roy KallolORCID,Yang ChengORCID,Rimolo-Donadio RenatoORCID,Schuster ChristianORCID

Funder

Funding Programme Open Access Publishing of the Hamburg University of Technology

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Engineering,General Materials Science,General Computer Science

Cited by 15 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. FNNs Models for Regression of S-Parameters in Multilayer Interconnects with Different Electrical Lengths;2023 IEEE MTT-S Latin America Microwave Conference (LAMC);2023-12-06

2. Automated Generation and Correlation of Physics-Based Via Models with Full-Wave Simulation for an SI/PI Database;2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS);2023-10-15

3. Engineering-Informed Design Space Reduction for PCB-Based Power Delivery Networks;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-10

4. Construction of Reciprocal Macromodels in the Loewner Matrix Framework;IEEE Transactions on Microwave Theory and Techniques;2023-08

5. A PEEC-informed Deep Learning Approach for Inverse Electromagnetic Problem in Heterogeneous Integrations;2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI);2023-07-29

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3