A Compact Single-Ended Inverter-Based Transceiver With Swing Improvement for Short-Reach Links-Reference-Cited by-同舟云学术

A Compact Single-Ended Inverter-Based Transceiver With Swing Improvement for Short-Reach Links

Published:2022-09 Issue:9 Volume:69 Page:3679-3688
ISSN:1549-8328
Container-title:IEEE Transactions on Circuits and Systems I: Regular Papers
language:
Short-container-title:IEEE Trans. Circuits Syst. I

Author:

Lee Myungguk¹^ORCID,Kaur Puneet Kanwar²,Seo Jaeyoung¹^ORCID,Han Seungho³,Kim Byungsub¹^ORCID

Affiliation:

1. Department of Electrical Engineering, Pohang University of Science and Technology, Pohang-si, South Korea

2. Intel Corporation, Bengaluru, Karnataka, India

3. Samsung Electronics, Hwaseong-si, Republic of Korea

Funder

Korean Government [Ministry of Science and ICT (MSIT)] under Commercializations Promotion Agency for Research and Development Outcomes (COMPA) Grant

Institute of Information and Communications Technology Planning and Evaluation (IITP) Grant

NRF under Project BK21 FOUR for the Department of Electrical Engineering, POSTECH

Samsung Electronics Company Ltd. under the Design and Application of Next Generation Non-Volatile Memory Hierarchy Cluster Academia Collaboration Program and Grant

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Hardware and Architecture

Link

http://xplorestaging.ieee.org/ielx7/8919/9865857/09788524.pdf?arnumber=9788524

Reference16 articles.

1. Improved sense-amplifier-based flip-flop: design and measurements

2. A 0.54 pJ/b 20 Gb/s Ground-Referenced Single-Ended Short-Reach Serial Link in 28 nm CMOS for Advanced Packaging Applications

3. A 10-GHz multi-purpose reconfigurable built-in self-test circuit for high-speed links

4. An Energy-Efficient Equalized Transceiver for RC-Dominant Channels

5. A 20 Gb/s/pin 1.18 pJ/b $1149 ~\mu\text{m}^{2}$ single-ended inverter-based 4-tap addition-only feed-forward equalization transmitter with improved robustness to coefficient errors in 28 nm CMOS;moon;IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers,2022

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