Sensitivity study of temperature and strain rate dependent properties on solder joint fatigue life-Reference-Cited by-同舟云学术

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Sensitivity study of temperature and strain rate dependent properties on solder joint fatigue life

Published: Issue: Volume: Page:
ISSN:
Container-title:Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235)
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Author:

Pang H.L.J.,Wang Y.P.,Shi X.Q.,Wang Z.P.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx4/6121/16369/00755999.pdf?arnumber=755999

Cited by 25 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method;Journal of Electronic Packaging;2023-11-10

2. Experimental characterization of cyclic behaviour of pure lead: Temperature sensitivity and strain-rate effects;Materials Science and Engineering: A;2023-05

3. Structural Modeling of REBCO VIPER Cable for High-Field Magnet Applications;IEEE Transactions on Applied Superconductivity;2022-09

4. Effect of SAC105 Solder Alloys High Strain Rate Property Evolution on Plastic Work at Low Operating Temperatures;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31

5. Effects of Aging on Microstructure and Mechanical Properties of Sn-Ag-Cu-Bi Solder Alloys;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06

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