Structural Modeling of REBCO VIPER Cable for High-Field Magnet Applications
Author:
Affiliation:
1. Mechanical Engineering Department, Tufts University, Medford, MA, USA
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/77/9712164/09695367.pdf?arnumber=9695367
Reference20 articles.
1. Cryogenic properties of metallic and non-metallic materials utilized in low temperature and superconducting magnets;brechna;Economics,1971
2. Properties and methods of lead/tin splices for superconductors;mruzek,0
3. Electrical and mechanical properties of lead/tin solders and splices for superconducting cables
4. Multiaxial mechanical behavior of 63Sn-37Pb solder
5. Sensitivity study of temperature and strain rate dependent properties on solder joint fatigue life
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