Author:
Lall Pradeep,Deshpande Shantanu,Kothari Nakul,Suhling Jeff,Nguyen Luu
Cited by
7 articles.
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1. Bending Experiments on QFN Components;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
2. Effect of potting on the solder joint reliability of QFN packages under thermal cycling load;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
3. Solder fatigue life modeling of QFN components based on design of experiments;Microelectronics Reliability;2024-01
4. Reliability Challenges and Mitigation Measures of Small Body-Sized Components on Complex and High-Layer Count PCBs;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
5. Reliability Improvement of Electronic Components: Influence of Design Parameters on Fatigue Life;2023 Smart Systems Integration Conference and Exhibition (SSI);2023-03-28