Reliability Challenges and Mitigation Measures of Small Body-Sized Components on Complex and High-Layer Count PCBs-Reference-Cited by-同舟云学术

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Reliability Challenges and Mitigation Measures of Small Body-Sized Components on Complex and High-Layer Count PCBs

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Su Peng¹,Ahmed Omar¹,Ahari Arman¹,Hutchinson Leif¹,Glasauer Bernard¹

Affiliation:

1. Juniper Networks,Sunnyvale,CA,USA,94089

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195569.pdf?arnumber=10195569

Reference10 articles.

1. Effect of Thermal Cycling on Reliability of QFN Packages

2. Effects of Heatsink Application and PCB Design Variations on BGA Solder Joint Reliability

3. High-density fan-out technology for advanced SiP and 3D heterogeneous integration

4. System on Integrated Chips (SoIC(TM) for 3D Heterogeneous Integration

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