Fatigue Life of Joint-Scale SAC305 Solder Specimens in Tensile and Shear Mode-Reference-Cited by-同舟云学术

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Fatigue Life of Joint-Scale SAC305 Solder Specimens in Tensile and Shear Mode

Published:2019-05 Issue: Volume: Page:
ISSN:
Container-title:2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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Author:

Deshpande Abhishek,Jiang Qian,Dasgupta Abhijit,Becker Ulrich

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8747321/8756497/08757405.pdf?arnumber=8757405

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals;Journal of Electronic Packaging;2023-10-05

2. Reduction of empiricism in the solder joint reliability assessment of QFN packages by using thermo-mechanical simulations;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17

3. Arrhenius Fatigue Life Modeling for Lead-Free Solder Joints in Accelerated Combined Fatigue and Creep Tests at Different Operating Temperatures;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-03

4. Hypergravity suppressed thermal diffusion at the Cu-Sn couple interface;Journal of Alloys and Compounds;2022-12

5. Effect of Aging Temperature on the Fatigue Resistance and Shear Strength of SAC305 Solder Joints;IEEE Transactions on Device and Materials Reliability;2022-06

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