Arrhenius Fatigue Life Modeling for Lead-Free Solder Joints in Accelerated Combined Fatigue and Creep Tests at Different Operating Temperatures-Reference-Cited by-同舟云学术

Arrhenius Fatigue Life Modeling for Lead-Free Solder Joints in Accelerated Combined Fatigue and Creep Tests at Different Operating Temperatures

Published:2023-03 Issue:3 Volume:13 Page:332-345
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Al Athamneh Raed¹^ORCID,Hani Dania Bani²^ORCID,Hamasha Sa’d³^ORCID,Abueed Mohammed³

Affiliation:

1. Department of Industrial Engineering, Faculty of Engineering, The Hashemite University, Zarqa, Jordan

2. Department of Industrial Engineering, Hijjawi Faculty for Engineering Technology, Yarmouk University, Irbid, Jordan

3. Department of Industrial and System Engineering, Samuel Ginn College of Engineering, Auburn University, Auburn, AL, USA

Funder

Center for Advanced Vehicle and Extreme Environment Electronics (CAVE3) at Auburn University

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

Reference32 articles.

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