Thermal modeling and design of 3D integrated circuits
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Publisher
IEEE
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http://xplorestaging.ieee.org/ielx5/4538254/4544243/04544389.pdf?arnumber=4544389
Cited by 36 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
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5. Thermal Design Current Control Mechanism using PID Controller in modern processors;2023 IEEE International Conference on Electronics, Computing and Communication Technologies (CONECCT);2023-07-14
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