Funder
Key Research and Development Projects of Shaanxi Province
National Natural Science Foundation of China
Publisher
Springer Science and Business Media LLC
Reference37 articles.
1. Jain A, Jones R, Ritwik C, Pozder S, Huang Z. Thermal modeling and design of 3D integrated circuits. In: 2008 11th intersociety conference on thermal and thermomechanical phenomena in electronic systems. Orlando, FL: IEEE; 2008. p. 28–31.
2. Yu H, Tang G, Gui J, Wang T, Huang B, Deng L, Jiang C. New development of thermal management technology for microsystems. Piezoelectr Acoustoopt. 2018;40(6):931–5 (in Chinese).
3. Kim Y, Kang SK, Kim SD, Kim S. Wafer warpage analysis of stacked wafers for 3D integration. Microelectron Eng. 2012;89:46–9.
4. Tian Q, Li P, Wei J, Xing Z, Qin G, Qin Z. Inverse Janus design of two-dimensional Rashba semiconductors. Phys Rev B. 2023;108(11):115130.
5. Wei D, Zheng X, Wang H, Shen C, Zhang H, Qin Z, Qing G. Electric-controlled tunable thermal switch based on Janus monolayer MoSSe. npj Comput Mater. 2022;8:260.
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