Advanced mixed-mode bending test: A rapid, inexpensive and accurate method for fracture-mechanical interface characterisation-Reference-Cited by-同舟云学术

Advanced mixed-mode bending test: A rapid, inexpensive and accurate method for fracture-mechanical interface characterisation

Published:2012-05 Issue: Volume: Page:
ISSN:
Container-title:13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
language:
Short-container-title:

Author:

Wunderle B.¹,Schulz M.¹,Keller J.²,Maus I.³,Pape H.³,Michel B.⁴

Affiliation:

1. Chemnitz University of Technology, Reichenhainer Str. 70, 09126, Germany

2. Angewandte Micro-Messtechnik GmbH, Volmerstr. 9 b, 12489 Berlin, Germany

3. Infineon Technologies AG, Am Campeon 1-12, 85579 Neubiberg, Germany

4. Fraunhofer Institute Electronic Nanosystems ENAS, Technologie-Campus 3, 09126 Chemnitz, Germany

Publisher

IEEE

Link

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Characterization and simulation of delamination on package-level considering sub-critical interfacial fracture-parameters under cyclic loading.;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17

3. Characterization of interfacial parameters for lifetime modelling in modern optical sensor package assemblies;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25