Author:
Reuther G.M.,Albrecht J.,Dudek R.,Rzepka S.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference30 articles.
1. Advances in delamination modeling;van der Sluis,2008
2. Mixed-mode bending method for delamination testing;Reeder;AIAA J.,1990
3. Establishing mixed mode fracture properties of EMC-copper (-oxide) interfaces at various temperatures;Xiao,2009
4. Advanced mixed-mode bending test: A rapid, inexpensive and accurate method for fracture-mechanical interface characterization;Wunderle,2012
5. A test specimen for determining the fracture resistance of bimaterial interfaces;Charalambides;J. Appl. Mech.,1989
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