Power, Performance, Area and Thermal Analysis of 2D and 3D ICs at A14 Node Designed with Back-side Power Delivery Network-Reference-Cited by-同舟云学术

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Power, Performance, Area and Thermal Analysis of 2D and 3D ICs at A14 Node Designed with Back-side Power Delivery Network

Published:2022-12-03 Issue: Volume: Page:
ISSN:
Container-title:2022 International Electron Devices Meeting (IEDM)
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Author:

Chen R.¹,Lofrano M.¹,Mirabelli G.¹,Sisto G.¹,Yang S.¹,Jourdain A.¹,Schleicher F.¹,Veloso A.¹,Zografos O.¹,Weckx P.¹,Hiblot G.¹,Plas G. Van der¹,Hellings G.¹,Ryckaert J.¹,Beyne E.¹

Affiliation:

1. IMEC,Leuven,Belgium

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10019319/10019320/10019349.pdf?arnumber=10019349

Reference8 articles.

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. BS-PDN Implemented the Latest Logic Devices for 14 Angstrom Technology Node;IEEE Transactions on Electron Devices;2024-07

2. Thermo-Mechanical Reliability Analysis and Raman Spectroscopy Characterization of Sub-micron Through Silicon Vias (TSVs) for Backside Power Delivery in 3D Interconnects;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Thermal Mitigation Strategy for Backside Power Delivery Network;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

4. Improved RF Performance with Buried Power Rail and Contact over Active Gate in Nanosheet FETs;2024 IEEE International Symposium on Circuits and Systems (ISCAS);2024-05-19

5. Scaling photonic integrated circuits with InP technology: A perspective;APL Photonics;2024-05-01

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