Fiber-Array-to-Chip Interconnections With Sub-Micron Placement Accuracy via Self-Aligning Chiplets-Reference-Cited by-同舟云学术

Fiber-Array-to-Chip Interconnections With Sub-Micron Placement Accuracy via Self-Aligning Chiplets

Published:2022-10-01 Issue:19 Volume:34 Page:1023-1025
ISSN:1041-1135
Container-title:IEEE Photonics Technology Letters
language:
Short-container-title:IEEE Photon. Technol. Lett.

Author:

Yu Shengtao¹^ORCID,Gaylord Thomas K.¹,Bakir Muhannad S.¹

Affiliation:

1. School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, USA

Funder

United States Air Force

Georgia Tech Institute for Electronics and Nanotechnology, a member of the National Nanotechnology Coordinated Infrastructure (NNCI), through the National Science Foundation

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

https://ieeexplore.ieee.org/ielam/68/9861407/9861207-aam.pdf

Reference8 articles.

1. Ultracompact Fiber-to-Chip Metamaterial Edge Coupler

2. Free-form micro-optics enabling ultra-broadband low-loss fiber-to-chip coupling;yu;arXiv 2112 14357,2021

3. Dual-band fiber-chip grating coupler in a 300 mm silicon-on-insulator platform and 193 nm deep-UV lithography

4. Two-dimensional apodized grating coupler for polarization-independent and surface-normal optical coupling

5. Fiber-Interconnect Silicon Chiplet Technology for Self-Aligned Fiber-to-Chip Assembly

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