Highly efficient fiber to Si waveguide free-form coupler for foundry-scale silicon photonics

Author:

Ranno LuigiORCID,Sia Jia Xu Brian1ORCID,Popescu CosminORCID,Weninger Drew,Serna Samuel2ORCID,Yu Shaoliang3ORCID,Kimerling Lionel C.,Agarwal AnuradhaORCID,Gu TianORCID,Hu Juejun

Affiliation:

1. Nanyang Technological University

2. Bridgewater State University

3. Zhejiang Laboratory

Abstract

As silicon photonics transitions from research to commercial deployment, packaging solutions that efficiently couple light into highly compact and functional sub-micrometer silicon waveguides are imperative but remain challenging. The 220 nm silicon-on-insulator (SOI) platform, poised to enable large-scale integration, is the most widely adopted by foundries, resulting in established fabrication processes and extensive photonic component libraries. The development of a highly efficient, scalable, and broadband coupling scheme for this platform is therefore of paramount importance. Leveraging two-photon polymerization (TPP) and a deterministic free-form micro-optics design methodology based on the Fermat’s principle, this work demonstrates an ultra-efficient and broadband 3-D coupler interface between standard SMF-28 single-mode fibers and silicon waveguides on the 220 nm SOI platform. The coupler achieves a low coupling loss of 0.8 dB for the fundamental TE mode, along with 1 dB bandwidth exceeding 180 nm. The broadband operation enables diverse bandwidth-driven applications ranging from communications to spectroscopy. Furthermore, the 3-D free-form coupler also enables large tolerance to fiber misalignments and manufacturing variability, thereby relaxing packaging requirements toward cost reduction capitalizing on standard electronic packaging process flows.

Funder

National Science Foundation

Ministry of Education—Singapore

Publisher

Optica Publishing Group

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