Defect-Directed Stress Testing Based on Inline Inspection Results

Author:

He Chen1,Grosch Paul1,Anilturk Onder1,Witowski Joyce1,Ford Carl1,Kalyan Rahul1,Robinson John C.2,Price David W.2,Rathert Jay2,Saville Barry2,Lee Dave2

Affiliation:

1. NXP Semiconductor,Austin,Texas,USA

2. KLA Corporation,Milpitas,California,USA

Publisher

IEEE

Reference12 articles.

1. Inline Part Average Testing (I-PAT) for automotive die reliability;price;SPIE Advanced Lithography,2020

2. The emergence of inline screening for high volume manufacturing

3. Special requirements for maverick product elimination and outlier management;JEDEC JESD50C,2018

4. Application of Inline Defect Part Average Testing (I-PAT™) to Identify Potential Latent Reliability Defect Escapes: Feasibility Study Results at NXP;anilturk;21st Annual Automotive Electronics Council Reliability Workshop,0

5. Reducing burn-in time through high-voltage stress test and Weibull statistical analysis

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1. Customizing ATPG User-Defined Stresses and Tests To Target Cell-Neighborhood-Bridging Defects;2024 IEEE 42nd VLSI Test Symposium (VTS);2024-04-22

2. Automotive Semiconductor Test: Challenges and Solutions towards Zero Defect Quality;2023 45th Annual EOS/ESD Symposium (EOS/ESD);2023-10-02

3. Test And Reliability Improvement With Defect-Image Classification And Machine-Learning Algorithms In Semiconductor Industry For Automotive Applications;2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);2023-07-24

4. Targeted Custom High-Voltage Stress Patterns on Automotive Designs;2023 IEEE 41st VLSI Test Symposium (VTS);2023-04-24

5. 38‐4:Invited Paper:Inline Screening Known Good Die (KGD) Mapping for MicroLEDs;SID Symposium Digest of Technical Papers;2022-06

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