Defect-Directed Stress Testing Based on Inline Inspection Results
Author:
Affiliation:
1. NXP Semiconductor,Austin,Texas,USA
2. KLA Corporation,Milpitas,California,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9983856/9983857/09983911.pdf?arnumber=9983911
Reference12 articles.
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4. Application of Inline Defect Part Average Testing (I-PAT™) to Identify Potential Latent Reliability Defect Escapes: Feasibility Study Results at NXP;anilturk;21st Annual Automotive Electronics Council Reliability Workshop,0
5. Reducing burn-in time through high-voltage stress test and Weibull statistical analysis
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