1. Calibration and Thermal Characterization of Multi-Chip SiC Power Modules: Challenges and Approaches;2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia);2024-05-17
2. Thermal Characterization of Power Module with BCI-ROMs;2023 IEEE Transportation Electrification Conference and Expo, Asia-Pacific (ITEC Asia-Pacific);2023-11-28
3. Design and Implementation of High-Speed Serial Transmission for ADC Based on JESD204B;2023 IEEE 3rd International Conference on Intelligent Technology and Embedded Systems (ICITES);2023-10-27
4. Thermal–Electrical Modeling and Co-Optimization of a Half-Bridge Power Module With Silver- Sintered Molybdenum Packaging;IEEE Transactions on Power Electronics;2023-09
5. Thermal Onboard Detection of Voids in the Solder Layer Between Power Semiconductor and PCB;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-08