Thermal–Electrical Modeling and Co-Optimization of a Half-Bridge Power Module With Silver- Sintered Molybdenum Packaging-Reference-Cited by-同舟云学术

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Thermal–Electrical Modeling and Co-Optimization of a Half-Bridge Power Module With Silver- Sintered Molybdenum Packaging

Published:2023-09 Issue:9 Volume:38 Page:11277-11289
ISSN:0885-8993
Container-title:IEEE Transactions on Power Electronics
language:
Short-container-title:IEEE Trans. Power Electron.

Author:

Yang Yuhang¹^ORCID,Zhou Linke¹^ORCID,Zayed Omar²,Alizadeh Maryam¹^ORCID,Stevanovic Doris³,Narimani Mehdi²^ORCID,Emadi Ali²^ORCID

Affiliation:

1. Department of Mechanical Engineering, McMaster University, Hamilton, ON, Canada

2. Department of Electrical and Computer Engineering, McMaster University, Hamilton, ON, Canada

3. Centre for Emerging Device Technologies, McMaster University, Hamilton, ON, Canada

Funder

Natural Sciences and Engineering Research Council of Canada

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/63/10197478/10138620.pdf?arnumber=10138620

Reference26 articles.

1. Multiobjective Design Optimization of IGBT Power Modules Considering Power Cycling and Thermal Cycling

2. High-Speed Analysis of Bus Bar Inductance for a Laminated Structure

3. Thermal optimization of IGBT modules based on finite element method and particle swarm optimization

4. PowerSynth: A Power Module Layout Generation Tool

5. Inductance calculations; methods and equations

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