Rapid In-line Process Window Characterization Using Voltage Contrast Test Structures for Advanced FinFET Technology Development
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Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/8781947/8791743/08791785.pdf?arnumber=8791785
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Novel Control Method and Applications for Negative Mode E-Beam Inspection;IEEE Transactions on Semiconductor Manufacturing;2023-08
2. In-line monitoring of overlay and process window using design-assisted voltage contrast inspection for 14nm FINFET technology;Metrology, Inspection, and Process Control XXXVI;2022-05-26
3. Negative Mode E-Beam Inspection of the Contact Layer;2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC);2022-05-02
4. Accelerating FinFET MOL Process Development Using Design for Inspection Methodology;2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC);2022-05-02
5. Electron Beam Inspection: Voltage Contrast Inspection to Characterize Contact Isolation;2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC);2020-08
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