Negative Mode E-Beam Inspection of the Contact Layer-Reference-Cited by-同舟云学术

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Negative Mode E-Beam Inspection of the Contact Layer

Published:2022-05-02 Issue: Volume: Page:
ISSN:
Container-title:2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
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Author:

Patterson Oliver D.¹,Faruk MD Golam¹,Zhang Datong²,He Guanchen²,Sheumaker Brian²

Affiliation:

1. Intel Corporation,Rio Rancho,NM 87124,USA

2. ASML,San Jose,CA, 95134,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9792471/9792473/09792528.pdf?arnumber=9792528

Reference9 articles.

1. E-Beam Inspection BVC (Bright Voltage Contrast) Verification for 14nm Technology;zhou;Proceedings of ASMC,2019

2. Real Time Fault Site Isolation of Front-end Defects in ULSI-ESRAM Utilizing In-Line Passive Voltage Contrast Analysis;patterson;Proc IST,2002

3. Creative Use of Vector Scan for Efficient SRAM Inspection

4. Effects of WCMP Process on Surface Charging Mode of Electron Beam Inspection;lai;CMP Planarization for ULSI,2007

5. Activation and Detectin of Buried Defects by Negative Mode E-Beam Inspection;buengener;Proceedings of ASMC,2021

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Novel Control Method and Applications for Negative Mode E-Beam Inspection;IEEE Transactions on Semiconductor Manufacturing;2023-08

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