Co-Optimization and Analysis of Signal, Power, and Thermal Interconnects in 3-D ICs-Reference-Cited by-同舟云学术

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Co-Optimization and Analysis of Signal, Power, and Thermal Interconnects in 3-D ICs

Published:2011-11 Issue:11 Volume:30 Page:1635-1648
ISSN:0278-0070
Container-title:IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
language:
Short-container-title:IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

Author:

Young-Joon Lee ,Sung Kyu Lim

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software

Link

http://xplorestaging.ieee.org/ielx5/43/6046160/06046179.pdf?arnumber=6046179

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. CFD Simulation Analysis of Inter/Intra Chip Liquid Cooling for 3D Stacked ICs;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30

2. A Review of Recent Research on Heat Transfer in Three-Dimensional Integrated Circuits (3-D ICs);IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-05

3. Unified Testing and Security Framework for Wireless Network-on-Chip Enabled Multi-Core Chips;ACM Transactions on Embedded Computing Systems;2019-10-19

4. Power and Thermal Constraints-Driven Modeling and Optimization for Through Silicon Via-Based Power Distribution Network;Journal of Electronic Packaging;2018-08-03

5. Reliability Challenges of Silicon-Based Physically Unclonable Functions;Physically Unclonable Functions;2018

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