Novel Spare TSV Deployment for 3-D ICs Considering Yield and Timing Constraints-Reference-Cited by-同舟云学术

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Novel Spare TSV Deployment for 3-D ICs Considering Yield and Timing Constraints

Published:2015-04 Issue:4 Volume:34 Page:577-588
ISSN:0278-0070
Container-title:IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
language:
Short-container-title:IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

Author:

Chen Yu-Guang,Wen Wan-Yu,Shi Yiyu,Hon Wing-Kai,Chang Shih-Chieh

Funder

Ministry of Science and Technology, Taiwan

National Science Foundation

NOVATEK Fellowship

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software

Link

http://xplorestaging.ieee.org/ielx7/43/7061937/06998006.pdf?arnumber=6998006

Cited by 18 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Cluster-aware allocation of spare TSVs for enhanced reliability in 3D ICs;Microelectronics Reliability;2023-12

2. 3D-IC のテスト技術;Journal of The Japan Institute of Electronics Packaging;2023-11-01

3. A cost-effective repair scheme for clustered TSV defects in 3D ICs;Microelectronics Reliability;2022-02

4. Vertical traversal approach towards TSVs optimisation over multilayer network on chip (NoC);Microelectronics Journal;2021-10

5. TSV-Cluster Defect Tolerance Using Tree-Based Redundancy for Yield Improvement of 3-D ICs;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2021-08

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