Author:
Maity Dilip Kumar,Roy Surajit Kumar,Giri Chandan
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference34 articles.
1. Three-dimensional integrated circuits for low-power, high-bandwidth systems on a chip;Burns,2001
2. 3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration;Banerjee;Proc. IEEE,2001
3. Demystifying 3D ICs: the pros and cons of going vertical;Davis;IEEE Des. Test Comput.,2005
4. Challenges and emerging solutions in testing TSV-based 2 1 over 2D-and 3D-stacked ICs;Marinissen,2012
5. Void formation over limiting current density and impurity analysis of TSV fabricated by constant-current pulse-reverse modulation;Lin;Microelectron. Reliab.,2013
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献