Combined Thermo-Reflectance and Thin-Film Coating in Near-Field Imaging of Chip-Package-PCB-Antenna Modules for Industrial-Testing and Failure Analysis
Author:
Affiliation:
1. eV-Technologies,France
2. Microsanj LLC,USA
3. LCC-CNRS,France
4. UCL-ICTEAM,Belgium
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10193881/10194256/10194284.pdf?arnumber=10194284
Reference7 articles.
1. Unprecedented switching endurance affords for high-resolution surface temperature mapping using a spin-crossover film
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1. An Innovative Non-invasive Analysis and Testing of Advanced Packaging Systems such as Antenna-in-Package and Antenna-on-Chip;2023 IEEE Conference on Antenna Measurements and Applications (CAMA);2023-11-15
2. Scalable Modular Beamformers for Energy-Efficient MIMO Applications Using Correlation Technologies;2023 IEEE Texas Symposium on Wireless and Microwave Circuits and Systems (WMCS);2023-04-19
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