Hyperspectral thermoreflectance imaging for power devices
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/7893853/7896886/07896931.pdf?arnumber=7896931
Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. High-Speed Thermal Imaging Can Resolve Short RF Pulse Effects in Tissue Models;IEEE Journal of Electromagnetics, RF and Microwaves in Medicine and Biology;2024-09
2. EM-Thermal Correlation Technologies for Industrial-Testing of 3D Heterogeneous Chip-Package-PCB-Antenna Modules;2024 IEEE Texas Symposium on Wireless and Microwave Circuits and Systems (WMCS);2024-04-03
3. An Innovative Non-invasive Analysis and Testing of Advanced Packaging Systems such as Antenna-in-Package and Antenna-on-Chip;2023 IEEE Conference on Antenna Measurements and Applications (CAMA);2023-11-15
4. Combined Thermo-Reflectance and Thin-Film Coating in Near-Field Imaging of Chip-Package-PCB-Antenna Modules for Industrial-Testing and Failure Analysis;2023 IEEE Texas Symposium on Wireless and Microwave Circuits and Systems (WMCS);2023-04-19
5. MEASUREMENT OF TEMPERATURE EFFECTS ON VOID GENERATION IN ELECTROMIGRATION USING THERMO-REFLECTANCE IMAGING;Proceeding of International Heat Transfer Conference 17;2023
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