An Innovative Non-invasive Analysis and Testing of Advanced Packaging Systems such as Antenna-in-Package and Antenna-on-Chip
Author:
Affiliation:
1. Microsanj LLC,USA
2. eV-Technologies,France
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10352598/10352648/10352695.pdf?arnumber=10352695
Reference6 articles.
1. SiGeC/Si superlattice microcoolers
2. Understanding the thermoreflectance coefficient for high resolution thermal imaging of microelectronic devices;Yazawa;Technical Brief, Electronics Cooling Magazine,2013
3. Hyperspectral thermoreflectance imaging for power devices
4. Combined Thermo-Reflectance and Thin-Film Coating in Near-Field Imaging of Chip-Package-PCB-Antenna Modules for Industrial-Testing and Failure Analysis
5. Scalable Modular Beamformers for Energy-Efficient MIMO Applications Using Correlation Technologies
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