Author:
Mok InSu,Bae JaeHun,Ki WonMyoung,Yoo HoDol,Ryu SeungMan,Kim SooHyun,Jung GyuIck,Hwang TaeKyeong,Do WonChul
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Encapsulation Technology for Advanced Packaging: Underfills/Molding Compounds;Journal of The Japan Institute of Electronics Packaging;2023-03-01
2. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023
3. Solutions to Overcome Warpage and Voiding Challenges in Fanout Wafer-level Packaging;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
4. Fan-Out Wafer/Panel-Level Packaging;Semiconductor Advanced Packaging;2021