Microwave industry outlook - microwaves for telecommunication systems
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Radiation
Link
http://xplorestaging.ieee.org/ielx5/22/21335/00989989.pdf?arnumber=989989
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4. Detection of Thermal Cycling-Induced Failures in RF/Microwave BGA Assemblies;IEEE Transactions on Electronics Packaging Manufacturing;2008-07
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