Detection of Thermal Cycling-Induced Failures in RF/Microwave BGA Assemblies-Reference-Cited by-同舟云学术

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Detection of Thermal Cycling-Induced Failures in RF/Microwave BGA Assemblies

Published:2008-07 Issue:3 Volume:31 Page:240-247
ISSN:1521-334X
Container-title:IEEE Transactions on Electronics Packaging Manufacturing
language:
Short-container-title:IEEE Trans. Electron. Packag. Manufact.

Author:

Putaala J.,Kangasvieri T.,Nousiainen O.,Jantunen H.,Moilanen M.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Link

http://xplorestaging.ieee.org/ielx5/6104/4558268/04550385.pdf?arnumber=4550385

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