An Integer-Linear-Programming-Based Routing Algorithm for Flip-Chip Designs

Author:

Fang Jia-Wei,Hsu Chin-Hsiung,Chang Yao-Wen

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software

Cited by 33 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Physical Design Challenges in Modern Heterogeneous Integration;Proceedings of the 2024 International Symposium on Physical Design;2024-03-12

2. ILP-based Substrate Routing with Mismatched Via Dimension Consideration for Wire-bonding FBGA Package Design;ACM Transactions on Design Automation of Electronic Systems;2023-09-08

3. Multilevel Fixed-Outline Component Placement and Graph-Based Ball Assignment for System in Package;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2023-09

4. Consumer Electronics Product Manufacturing Time Reduction and Optimization Using AI-Based PCB and VLSI Circuit Designing;IEEE Transactions on Consumer Electronics;2023-08

5. Any-Angle Routing for Redistribution Layers in 2.5D IC Packages;2023 60th ACM/IEEE Design Automation Conference (DAC);2023-07-09

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