Physical Design Challenges in Modern Heterogeneous Integration-Reference-Cited by-同舟云学术

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Physical Design Challenges in Modern Heterogeneous Integration

Published:2024-03-12 Issue: Volume:21 Page:125-134
ISSN:
Container-title:Proceedings of the 2024 International Symposium on Physical Design
language:
Short-container-title:

Author:

Chang Yao-Wen¹^ORCID

Affiliation:

1. Graduate Institute of Electronics Engineering, National Taiwan University & Department of Electrical Engineering, National Taiwan University, Taipei, Taiwan

Publisher

ACM

Link

https://dl.acm.org/doi/pdf/10.1145/3626184.3639690

Reference62 articles.

1. 2022. DOMO data never sleeps 10.0. https://www.domo.com/data-never-sleeps

2. 2023. Heterogeneous Integration Roadmap 2023 Edition. https://eps.ieee.org/ technology/heterogeneous-integration-roadmap/2023-edition.html

3. 2023. IEEE International Roadmap for Devices and Systems (IRDS). https://irds. ieee.org

4. 2023. International Technology Roadmap for Semiconductors (ITRS). http://www. itrs2.net/

5. 2023. Silicon photonics reshapes the future; TSMC, ASE ready to seize market share. https://www.trendforce.com/news/2023/12/04/news-silicon-photonicsreshapes-the-future-tsmc-ase-ready-to-seize-market-share/

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