1. Southern University of Science and Technology,Joint Lab for Advanced Semiconductor Packaging Technologies; Joint Lab for Advanced Packaging and Testing Technology of Integrated Circuits; School of Microelectronics,Shenzhen,China
2. Fudan University,Academy for Engineering&Technology,Shanghai,China
3. Delft University of Technology,Electrical Engineering, Mathematics and Computer Science,Delft,The Netherlands
4. Harbin Medical University,School of Medical Informatics, Daqing Campus,Daqing,China