Warpage Control Method in Fan-Out Wafer Level Packaging with Rectangular Chips-Reference-Cited by-同舟云学术

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Warpage Control Method in Fan-Out Wafer Level Packaging with Rectangular Chips

Published:2023-08-08 Issue: Volume: Page:1-5
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Yan Zhenghan¹,Zhong Cheng²,Jiang Pengcheng²,Ma Chi²,Liu Shuang²,Zeng Dan²,Wang Hong²,Hu Zhengxun²,Sun Rong²

Affiliation:

1. Chinese Academy of Sciences Southern University of Science and Technology,Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology,Shenzhen,China

2. Chinese Academy of Sciences,Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology,Shenzhen,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10491984.pdf?arnumber=10491984

Reference8 articles.

1. Parametric study of thermally induced warpage of FpBGA package using finite element methods

2. Fifty Years of Moore's Law

3. An Embedded Device Technology Based on a Molded Reconfigured Wafer

4. Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

5. Warpage Analysis of Fan-Out Panel-Level Packaging Using Equivalent CTE

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