Influence of Cu heat sink on heat dissipation of QFN package
Author:
Affiliation:
1. Shanghai Jiao Tong University,Institute of Electronic Materials & Technology, School of Materials Science and Engineering,Shanghai,China,200240
2. Dongguan IC Carrier Technology Co. Ltd.,Dongguan,China,523808
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492399.pdf?arnumber=10492399
Reference5 articles.
1. Thermal analysis of the design parameters of a QFN package soldered on a PCB using a simulation approach
2. Thermal characterization of a thermally enhanced QFN package
3. Investigation of natural convection heat transfer performance of the QFN-PCB electronic module by using nanofluid for power electronics cooling applications
4. Experimental investigation of a topology-optimized phase change heat sink optimized for natural convection
5. Investigations on Heat Transfer Characteristics of Porous Type Copper Heat Sink with Bifurcations
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