Author:
Hollstein K.,Yang X.,Weide-Zaage K.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference19 articles.
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4. "Thermal Characterization of a QFN electronic Package accompanied by a reliability study based on a response surface approach" 4th IEEE International Colloquium on Information Science and Technology;Bendaou,2016
5. "Impact of board variables on the thermal performance of QFN packages" Thermal and Thermomechanical Phenomena in Electronic Systems;Montes de Oca,2002
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