Automatic tool for real-time estimation of QFN-related heat transfer in multi-layer PCB by using SPICE simulations
Author:
Affiliation:
1. Politecnico di Bari,Department of Electrical and Information Engineering,Bari,Italy,70125
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10164122/10164290/10164511.pdf?arnumber=10164511
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1. Thermal Resistance Modeling to Analyze and Simulate of Quad Flat No-Leads Packaging on Printed Circuit Board by Using ANSYS;2024 IEEE 7th International Electrical and Energy Conference (CIEEC);2024-05-10
2. Quick SPICE-Based Heat Transfer Estimator for QFN Packages on Multilayer PCB;Lecture Notes in Electrical Engineering;2023-11-29
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