Automatic tool for real-time estimation of QFN-related heat transfer in multi-layer PCB by using SPICE simulations-Reference-Cited by-同舟云学术

Automatic tool for real-time estimation of QFN-related heat transfer in multi-layer PCB by using SPICE simulations

Published:2023-06-08 Issue: Volume: Page:
ISSN:
Container-title:2023 9th International Workshop on Advances in Sensors and Interfaces (IWASI)
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Author:

Mezzina Giovanni¹,Brunetti Alberto Fakhri¹,Saragaglia Cataldo Luciano¹,Matarrese Gianvito¹,Venuto Daniela De¹

Affiliation:

1. Politecnico di Bari,Department of Electrical and Information Engineering,Bari,Italy,70125

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10164122/10164290/10164511.pdf?arnumber=10164511

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2. Quick SPICE-Based Heat Transfer Estimator for QFN Packages on Multilayer PCB;Lecture Notes in Electrical Engineering;2023-11-29