Effects of Ge addition on the growth of interfacial Ni<sub>3</sub>Sn<sub>4</sub> IMC in the Sn58Bi/Ni solder joint: First-principles and Experimental Investigations-Reference-Cited by-同舟云学术

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Effects of Ge addition on the growth of interfacial Ni₃Sn₄ IMC in the Sn58Bi/Ni solder joint: First-principles and Experimental Investigations

Published:2023-08-08 Issue: Volume: Page:1-6
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Zhang Shasha¹,Ye Ziting¹,Wei Yuhang¹,Sheng Bo¹,Dong Zhaoteng¹,Zheng Bing¹,Zhao Xiuchen¹

Affiliation:

1. Beijing Institute of Technology,School of Materials Science & Engineering,Beijing,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492030.pdf?arnumber=10492030

Reference14 articles.

1. Erratum to: The effect of joint size on the creep properties of microscale lead-free solder joints at elevated temperatures

2. 1/f noise measurements for faster evaluation of electromigration in advanced microelectronics interconnections

3. Alloying regulation mechanism toward microstructure evolution of Sn-bi-based solder joint under current stress

4. Interfacial reactions between lead-free solders and common base materials

5. Growth behavior of intermetallic compounds and early formation of cracks in Sn-3Ag-0.5Cu solder joints under extreme temperature thermal shock

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