High energy dissipation composite elastomer for application as a thermal interface material through solvent-induced dis-entanglement-Reference-Cited by-同舟云学术

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High energy dissipation composite elastomer for application as a thermal interface material through solvent-induced dis-entanglement

Published:2023-08-08 Issue: Volume: Page:1-6
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Wu Weijian¹,Wang Hangqian¹,Zeng Xiangliang¹,Hao Zhifeng²,Fan Jianfeng¹,Ren Linlin¹

Affiliation:

1. Chinese Academy of Sciences,Shenzhen Institute of Advanced Electronic Materials Shenzhen Institute of Advanced Technology,Shenzhen,China

2. Guangdong University of Technology,Guangdong Provincial Key Laboratory of Plant Resources Biorefinery, School of Chemical Engineering and Light Industry,Guangzhou,China

Funder

National Natural Science Foundation of China

Chinese Academy of Sciences

China Postdoctoral Science Foundation

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492270.pdf?arnumber=10492270

Reference12 articles.

1. Highly Precise Multifunctional Thermal Management-Based Flexible Sensing Sheets

2. Emerging Materials and Strategies for Personal Thermal Management

3. Chemo-Mechanically Exfoliated Boron Nitride Nanosheet/Poly(Vinyl Alcohol) Composites as Efficient Heat Dissipation Components

4. Microstructure and Dielectric Properties of PTFE-Based Composites Filled by Micron/Submicron-Blended CCTO

5. Innovative analytic and experimental methods for thermal management of SMD-type LED chips

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