Innovative analytic and experimental methods for thermal management of SMD-type LED chips-Reference-Cited by-同舟云学术

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Innovative analytic and experimental methods for thermal management of SMD-type LED chips

Published:2018-09 Issue: Volume:124 Page:36-45
ISSN:0017-9310
Container-title:International Journal of Heat and Mass Transfer
language:en
Short-container-title:International Journal of Heat and Mass Transfer

Author:

Jang Hosung,Lee Jae Hwa,Byon Chan,Lee Byeong Jun

Funder

UNIST

Korea Institute of Energy Technology Evaluation and Planning

Ministry of Trade, Industry & Energy

National Research Foundation of Korea

Ministry of Science, ICT and Future Planning

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference15 articles.

1. Capillary performance of bi-porous sintered metal wicks;Byon;Int. J. Heat Mass Transfer,2012

2. Permeability of microporous wicks with geometric inverse to sintered particles;Ngo;Int. J. Heat Mass Transfer,2016

3. Thermal performance of plate fin heat sinks with dual-height fins subject to natural convection;Jeon;Int. J. Heat Mass Transfer,2017

4. Investigation of natural convection heat transfer around a radial heat sink with a perforated ring;Li;Int. J. Heat Mass Transfer,2016

5. Enhanced natural convection heat transfer of a chimney-based radial heat sink;Li;Energy Convers. Manage.,2016

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1. LED Junction Temperature Measurement: From Steady State to Transient State;Sensors;2024-05-08

2. Large-sized light-emitting diode integrated with a thermopile for on-chip temperature and power monitoring;Optics Letters;2024-01-25

3. Soft, Tough, and Thermally Conductive Elastomer Composites by Constructing a Curled Conformation;Chemistry of Materials;2023-09-11

4. High energy dissipation composite elastomer for application as a thermal interface material through solvent-induced dis-entanglement;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

5. Experimental and numerical analysis of effect of combined drop-shape pin fins and plate fins type heat sink under natural convection;Numerical Heat Transfer, Part A: Applications;2023-04-07

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