Ablation Behaviour of Photosensitive Materials in Laser Debonding Processes for Advanced Packaging
Author:
Affiliation:
1. Chinese Academy of Sciences,Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology,Shenzhen,China,518055
Funder
National Natural Science Foundation of China
Engineering Laboratory
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492262.pdf?arnumber=10492262
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1. Laser Lift‐Off Technologies for Ultra‐Thin Emerging Electronics: Mechanisms, Applications, and Progress
2. Ultra-thin chips for high-performance flexible electronics
3. Study of Bondable Laser Release Material Using 355 nm Energy to Facilitate RDL-First and Die-First Fan-Out Wafer-Level Packaging (FOWLP)
4. Fabrication and high-frequency characterization of low-cost fan-in/out WLP technology with RDL for 2.5D/3D heterogeneous integration
5. 3D TSV mid-end processes and assembly/packaging technology;Yoon
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