Fabrication and high-frequency characterization of low-cost fan-in/out WLP technology with RDL for 2.5D/3D heterogeneous integration
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Subject
General Engineering
Reference27 articles.
1. Panel-level fan-out rdl-first packaging for heterogeneous integration;Lau;IEEE Trans. Compon. Packag. Manuf. Technol.,2020
2. silicon-interconnect fabric for fine-pitch (≤10 μm) heterogeneous integration;Jangam;IEEE Trans. Compon. Packag. Manuf. Technol.,2021
3. Silicon interposer package for MMIC heterogeneous integration based on gold/solder ball flip-chip technique;Shi;IEEE Trans. Compon. Packag. Manuf. Technol.,2019
4. Ultra-compact TSV-based L-C low-pass filter with stopband up to 40 GHz for microwave application;Yin;IEEE Trans. Microw. Theor. Tech.,2019
5. Miniaturized SIW bandpass filter based on TSV technology for THz applications;Wang;IEEE Trans. THz Sci. Technol.,2020
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