Laser Lift‐Off Technologies for Ultra‐Thin Emerging Electronics: Mechanisms, Applications, and Progress-Reference-Cited by-同舟云学术

Laser Lift‐Off Technologies for Ultra‐Thin Emerging Electronics: Mechanisms, Applications, and Progress

Author:

Wang Fangcheng¹²,Liu Qiang¹,Xia Jianwen³,Huang Mingqi³,Wang Xuefan¹,Dai Wenxue¹,Zhang Guoping¹^ORCID,Yu Daquan⁴,Li Jinhui¹,Sun Rong¹

Affiliation:

1. Shenzhen Institute of Advanced Electronic Materials Shenzhen Institutes of Advanced Technology Chinese Academy of Sciences Shenzhen 518055 China

2. Institute of Materials Research Tsinghua Shenzhen International Graduate School Tsinghua University Shenzhen 518055 China

3. Shenzhen Samcien Semiconductor Materials Co., Ltd Shenzhen 518103 China

4. School of Electronic Science and Engineering Xiamen University Xiamen 361005 China

Funder

National Natural Science Foundation of China

Publisher

Wiley

Subject

Industrial and Manufacturing Engineering,Mechanics of Materials,General Materials Science

Link

Reference112 articles.

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