Efficient ILT via Multi-level Lithography Simulation
Author:
Affiliation:
1. Fudan University,State Key Laboratory of Integrated Chips and Systems,Shanghai,China
2. Chinese University of Hong Kong,Hong Kong,China
Funder
National Natural Science Foundation of China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10247654/10247655/10247704.pdf?arnumber=10247704
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