CACTI-3DD: Architecture-level modeling for 3D die-stacked DRAM main memory-Reference-Cited by-同舟云学术

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CACTI-3DD: Architecture-level modeling for 3D die-stacked DRAM main memory

Published:2012-03 Issue: Volume: Page:
ISSN:
Container-title:2012 Design, Automation & Test in Europe Conference & Exhibition (DATE)
language:
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Author:

Ke Chen ,Sheng Li ,Muralimanohar N.,Jung Ho Ahn ,Brockman J. B.,Jouppi N. P.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6171057/6176405/06176428.pdf?arnumber=6176428

Cited by 17 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. NeuroCool: Dynamic Thermal Management of 3D DRAM for Deep Neural Networks through Customized Prefetching;ACM Transactions on Design Automation of Electronic Systems;2023-12-18

2. Thermal Management for 3D-Stacked Systems via Unified Core-Memory Power Regulation;ACM Transactions on Embedded Computing Systems;2023-09-09

3. NTT-PIM: Row-Centric Architecture and Mapping for Efficient Number-Theoretic Transform on PIM;2023 60th ACM/IEEE Design Automation Conference (DAC);2023-07-09

4. Is the Future Cold or Tall? Design Space Exploration of Cryogenic and 3D Embedded Cache Memory;2023 IEEE International Symposium on Performance Analysis of Systems and Software (ISPASS);2023-04

5. CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5D, and 3D Processor-Memory Systems;ACM Transactions on Architecture and Code Optimization;2022-08-22

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