3D Embedded multi-core: Some perspectives
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/5754459/5762992/05763213.pdf?arnumber=5763213
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Thermal and Voltage-Aware Performance Management of 3-D MPSoCs With Flow Cell Arrays and Integrated SC Converters;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2023-01
2. Vertical traversal approach towards TSVs optimisation over multilayer network on chip (NoC);Microelectronics Journal;2021-10
3. Analyzing the Trade-off Between Different Memory Cores and Controllers;Analog Circuits and Signal Processing;2016
4. On optimizing system energy of voltage–frequency island based 3-D multi-core SoCs under thermal constraints;Integration;2015-01
5. A survey of memory architecture for 3D chip multi-processors;Microprocessors and Microsystems;2014-07
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