Impact reliability of solder joints-Reference-Cited by-同舟云学术

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Impact reliability of solder joints

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Container-title:2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546)
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Author:

Date M.,Shoji T.,Fujiyoshi M.,Sato K.,Tu K.N.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/9210/29234/01319410.pdf?arnumber=1319410

Cited by 56 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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4. Intermetallic and tensile study of the newly developed Sn-2.0Ag-0.7Cu solder with addition of 0.5 wt.% zinc;AIP Conference Proceedings;2018

5. Ball-grid-array solder joint model for assembly-level impact reliability prediction;Microelectronics Reliability;2016-10

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