Intermetallic and tensile study of the newly developed Sn-2.0Ag-0.7Cu solder with addition of 0.5 wt.% zinc
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http://aip.scitation.org/doi/pdf/10.1063/1.5066957
Reference18 articles.
1. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
2. Interfacial reactions between lead-free solders and common base materials
3. Effect of Zn on properties and microstructure of SnAgCu alloy
4. Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals
5. Lead-free Solders in Microelectronics
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