Micro Impact Characterisation of Solder Joint for Drop Impact Application-Reference-Cited by-同舟云学术

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Micro Impact Characterisation of Solder Joint for Drop Impact Application

Published: Issue: Volume: Page:
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Container-title:56th Electronic Components and Technology Conference 2006
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Author:

Wong E.H.,Mai Y.-W.,Rajoo R.,Tsai K.T.,Liu F.,Seah S.K.W.,Yeh C.-L.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/10951/34490/01645627.pdf?arnumber=1645627

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Ball impact responses of Sn-1Ag-0.5Cu solder joints at different temperatures and surface finishes;Microelectronics Reliability;2018-03

2. High-Speed Camera Investigation into Fracture Behavior of Solder Ball Joints Under Dynamic Loading;Experimental Techniques;2016-03-31

3. A Novel Mechanism of Embrittlement Affecting the Impact Reliability of Tin-Based Lead-Free Solder Joints;Journal of Electronic Materials;2009-05-28

4. Frequency dependent S-N curves for predicting drop impact robustness of Pb-free solder interconnects;2009 59th Electronic Components and Technology Conference;2009-05

5. A review of board level solder joints for mobile applications;Microelectronics Reliability;2008-11

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