Author:
Wojnowski M.,Engl M.,Dehlink B.,Sommer G.,Brunnbauer M.,Pressel K.,Weigel R.
Cited by
8 articles.
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3. Embedded-IC package using Si-interposer for mmWave Applications;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
4. Antenna Integration in eWLB Package;Antenna‐in‐Package Technology and Applications;2020-03-06
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