1. ITRS Assembly and Packaging Tables-2012 2012
2. Kevin Rinebold David West Jack Parkes High Performance IC/Package Design and Analysis
3. Michael Santarini Co-designs’ EDA Vendor Guidelines for IC-Package Designers for Effective Work 2008
4. Electrical characterization of integrated circuit molding compound;Green;On Advanced Packaging,1999
5. IC Advanced Packaging Technology 2009